PRODUCTS

Electroless Copper

Using our patented palladium chloride catalyst, we deposit a thin layer of copper that is high in adhesion and uniformity to make vias and through holes conductive for subsequent steps.

Suitable for traditional or pusher-type vertical and horizontal process.

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Desmear

Using permanganate to create a suitable surface for metallization and improve adhesion.

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Oxide Process

Adhesion promoter for copper surface and pre-preg.

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Cleaners

Our proprietary cleaners that are low-foaming, easy to clean and sufficiently reduce surface tension of the boards. 

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Anti-tarnish and Others

Low consumption anti-tarnish solution for copper surfaces.

Rack stripper to reduce cost.

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Please enquire for more information.